Topology optimization of heat sinks for instantaneous chip cooling using a transient pseudo-3D thermofluid model

Engineering

• Transients 100%
• Thermal Performance 100%
• Thermofluids 100%
• Computational Cost 50%
• Heat Generation 50%
• Optimisation Procedure 50%
• Heat Losses 50%
• Optimization Method 50%
• Optimised Design 50%
• Engineering Application 50%
• Power Density 50%
• Pumping Power 50%
• Material Distribution 50%
• Baseplate 50%
• Interpolation Function 50%
• Constant Pressure Drop 50%
• Convection Coefficient 50%
• Inlet Pressure 50%