Topology optimization of heat sinks for instantaneous chip cooling using a transient pseudo-3D thermofluid model

Tao Zeng, Hu Wang^*, Mengzhu Yang, Joe Alexandersen

^*Corresponding author for this work

Hunan University

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Topology optimization of heat sinks for instantaneous chip cooling using a transient pseudo-3D thermofluid model
Alexandersen, J. (Guest lecturer)
27. Aug 2020
Activity: Talks and presentations › Conference presentations