Abstract
This paper revisits the optimal thickness profile problem of a single cooling fin using a one-dimensional heat conduction equation with a convection boundary condition. Firstly, in contrast to previous works, we apply an approach using optimality conditions based on requiring stationarity of the Lagrangian functional of the optimisation problem. This yields an optimality condition basis for the commonly touted constant temperature gradient condition. Secondly, we seek to minimise the base temperature for a prescribed thermal power, rather than maximising the heat transfer rate for a constant base temperature as previous works. The optimal solution is shown to be fully equivalent for the two, which may seem obvious but to our knowledge has not been shown directly before. Lastly, it is shown that optimal cooling fins have a Biot number of 1, exhibiting perfect balance between conductive and convective resistances.
Original language | English |
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Title of host publication | 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) |
Publisher | IEEE |
Publication date | 9. Aug 2021 |
Pages | 24-30 |
ISBN (Electronic) | 978-1-7281-8539-2 |
DOIs | |
Publication status | Published - 9. Aug 2021 |
Event | 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2021) - Virtual, San Diego, United States Duration: 1. Jun 2021 → 4. Jun 2021 Conference number: 20 |
Conference
Conference | 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2021) |
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Number | 20 |
Location | Virtual |
Country/Territory | United States |
City | San Diego |
Period | 01/06/2021 → 04/06/2021 |
Series | Intersociety Conference on Thermal and Thermomechanical in Electronic Systems. Proceedings |
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ISSN | 1936-3958 |
Keywords
- Cooling fin
- Optimal design
- Optimality conditions