TY - GEN
T1 - Plasmonic Signals Modified by Dielectric Layers and Exploited by Multivariate Analysis
AU - Etxebarria-Elezgarai, Jaione
AU - Bergamini, Luca
AU - Lopez Corrillero, Eneko
AU - Morant-Minana, Maria Carmen
AU - Adam, Jost
AU - Seifert, Andreas
N1 - Funding Information:
Funding: Spanish Ministry of Economy, Industry and Competitiveness -Maria de Maeztu Units of Excellence Programme – MDM-2016-0618; Basque Government (KK-2018/00001, KK-2020/00001).
Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - We present a sensing device that combines plasmonic Au nanodiscs with dielectric layers. The sensor is operated in Kretschmann configuration and provides highly complex and sensitive reflectance curves as a result of hybridized plasmons and Fresnel reflections from the microfluidic device in which the plasmonic chip is embedded. Using multi-variate analysis to analyze multiple features of the reflectance curves in angular interrogation contributes significantly to the improvement of the sensing performance compared to a standard continuous Au thin film sensor chip. We improve sensitivity twofold and prediction error by almost 40%.
AB - We present a sensing device that combines plasmonic Au nanodiscs with dielectric layers. The sensor is operated in Kretschmann configuration and provides highly complex and sensitive reflectance curves as a result of hybridized plasmons and Fresnel reflections from the microfluidic device in which the plasmonic chip is embedded. Using multi-variate analysis to analyze multiple features of the reflectance curves in angular interrogation contributes significantly to the improvement of the sensing performance compared to a standard continuous Au thin film sensor chip. We improve sensitivity twofold and prediction error by almost 40%.
KW - 2D Au metamaterial
KW - Fresnel reflections
KW - multivariate analysis
KW - Plasmonic sensing
U2 - 10.1109/OMN/SBFotonIOPC58971.2023.10230973
DO - 10.1109/OMN/SBFotonIOPC58971.2023.10230973
M3 - Article in proceedings
AN - SCOPUS:85173573307
T3 - International Conference on Optical MEMS and Nanophotonics
BT - 2023 International Conference on Optical MEMS and Nanophotonics (OMN) and SBFoton International Optics and Photonics Conference (SBFoton IOPC)
PB - IEEE
T2 - 2023 International Conference on Optical MEMS and Nanophotonics and SBFoton International Optics and Photonics Conference, OMN/SBFoton IOPC 2023
Y2 - 31 July 2023 through 3 August 2023
ER -