Integrated Idea Management in Emerging Technology Ventures

K.-I. Voigt, Alexander Brem

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Original languageEnglish
Title of host publicationInternational Conference on Management of Innovation and Technology Proceedings
EditorsK.H. Chai
Volume1
Place of PublicationSingapore
Publication date2006
Pages211-215
Publication statusPublished - 2006

Cite this

Voigt, K-I., & Brem, A. (2006). Integrated Idea Management in Emerging Technology Ventures. In K. H. Chai (Ed.), International Conference on Management of Innovation and Technology Proceedings (Vol. 1, pp. 211-215). Singapore.
Voigt, K.-I. ; Brem, Alexander. / Integrated Idea Management in Emerging Technology Ventures. International Conference on Management of Innovation and Technology Proceedings. editor / K.H. Chai. Vol. 1 Singapore, 2006. pp. 211-215
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title = "Integrated Idea Management in Emerging Technology Ventures",
author = "K.-I. Voigt and Alexander Brem",
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Voigt, K-I & Brem, A 2006, Integrated Idea Management in Emerging Technology Ventures. in KH Chai (ed.), International Conference on Management of Innovation and Technology Proceedings. vol. 1, Singapore, pp. 211-215.

Integrated Idea Management in Emerging Technology Ventures. / Voigt, K.-I.; Brem, Alexander.

International Conference on Management of Innovation and Technology Proceedings. ed. / K.H. Chai. Vol. 1 Singapore, 2006. p. 211-215.

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

TY - GEN

T1 - Integrated Idea Management in Emerging Technology Ventures

AU - Voigt, K.-I.

AU - Brem, Alexander

PY - 2006

Y1 - 2006

M3 - Article in proceedings

VL - 1

SP - 211

EP - 215

BT - International Conference on Management of Innovation and Technology Proceedings

A2 - Chai, K.H.

CY - Singapore

ER -

Voigt K-I, Brem A. Integrated Idea Management in Emerging Technology Ventures. In Chai KH, editor, International Conference on Management of Innovation and Technology Proceedings. Vol. 1. Singapore. 2006. p. 211-215