Fast Switching Planar Power Module with SiC MOSFETs and Ultra-low Parasitic Inductance

Arash Edvin Risseh, Hans Peter Nee, Konstantin Kostov

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Abstract

Parasitic inductances caused by the package of semiconductor devices in power converters, are limiting the switching speed and giving rise to higher switching losses than necessary. In this study a half-bridge planar power module with Silicon Carbide (SiC) MOSFET bare dies was designed and manufactured for ultra-low parasitic inductance. The circuit structure was simulated and the parasitic inductances were extracted from ANSYS-Q3D. The values were then fed into LT-Spice to simulate the electrical behavior of the half-bridge. The experimental and simulation results were compared to each other and were used to adjust and easily extend the simulation model with additional MOSFETs for higher current capability. It was shown that the proposed planar module, with four parallel SiC MOSFETs at each position, is able to switch 600V and 400A during 40 and 17ns with EON and EOFF equal to 3.1 and 1.3mJ, respectively. Moreover, unlike the commercial modules, this design allows double-sided cooling to extract the generated heat from the device, resulting in lower operating temperature.

Original languageEnglish
Title of host publication2018 International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018
PublisherIEEE
Publication date22. Oct 2018
Pages2732-2737
ISBN (Print)9781538641903
ISBN (Electronic)9784886864055
DOIs
Publication statusPublished - 22. Oct 2018
Event8th International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018 - Niigata, Japan
Duration: 20. May 201824. May 2018

Conference

Conference8th International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018
Country/TerritoryJapan
CityNiigata
Period20/05/201824/05/2018
SponsorIEEE Industry Applications Society, IEEE Power Electronics Society, IEEJ Industry Applications Society (IAS)

Keywords

  • bare die
  • double sided cooling
  • fast switching
  • PCB
  • planar power module
  • SiC MOSFET
  • ultra-low parasitic inductance

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