The invention relates to process for manufacturing a thin and stable copper film on a porous aluminum oxide (PAO) film on an aluminum alloy substrate. Initially, anodization of the aluminum alloy substrate results in a regularly ordered PAO film; and subsequently there is electrodeposited copper on this PAO/aluminum substrate, the electrodepositing comprises the use of direct current (DC), preferably 10-15 V, so as to deposit metallic copper both: 1) in the open pores of the regularly ordered PAO film, and 2) on the top of the regularly ordered PAO film, so as to form a copper film on top of the PAO film. The anodization is performed so as to improve the adhesion and electrochemical corrosion stability i.e. with no, or little, galvanic corrosion of the electrodeposited copper on the PAO/aluminum substrate. The copper coverage is substantially continuous on the PAO/aluminum substrate.
|Translated title of the contribution||En metode til at danne kobberlag på porøst aluminium oxid (PAO) på et substrat af aluminium legering|
|Patent number||WO 2022/008439|
|Priority number||EP20200184136 20200706|
|Publication status||Published - 13. Jan 2022|