Effects of 3D microlens transfer into fused silica substrate by CF4/O2 dry etching

Sigitas Tamulevičius, Viktoras Grigaliūnas*, Dalius Jucius, Algirdas Lazauskas, Mindaugas Andrulevičius, Jolita Sakaliūnienė, Brigita Abakevičienė, Vitoldas Kopustinskas, Saulius Smetona

*Corresponding author for this work

Research output: Contribution to journalJournal articleResearchpeer-review

Abstract

Nowadays, 3D microoptical elements find a variety of applications from light emitting diodes and household appliances to precise medical endoscopes. Such elements, fabricated in a fused silica substrate by combining 3D e-beam patterning and dry etching, can be used as a mold for the high throughput replication in polymeric materials by UV nanoimprint technique. Flexible and precise control of 3D shape in the resist layer can be achieved by e-beam patterning, but it is also very important to know peculiarities of 3D pattern transfer from resist layer into the fused silica substrate. This paper reports on the effects of PMMA 3D microlens pattern transfer into fused silica substrate by CF4/O2 dry etching. It is demonstrated that etching rate ratio between PMMA and fused silica changes during plasma treatment. Thus, the resulting shape of transferred 3D profile is different from the shape in PMMA and this variation must be assessed during the design phase.

Original languageEnglish
JournalApplied Surface Science
Volume393
Pages (from-to)287-293
ISSN0169-4332
DOIs
Publication statusPublished - 2017

Fingerprint

Dry etching
Fused silica
Substrates
Domestic appliances
Endoscopy
Light emitting diodes
Etching
Throughput
Plasmas
Polymers

Keywords

  • Dry etching
  • e-Beam patterning
  • Fused silica
  • Microlens
  • PMMA

Cite this

Tamulevičius, S., Grigaliūnas, V., Jucius, D., Lazauskas, A., Andrulevičius, M., Sakaliūnienė, J., ... Smetona, S. (2017). Effects of 3D microlens transfer into fused silica substrate by CF4/O2 dry etching. Applied Surface Science, 393, 287-293. https://doi.org/10.1016/j.apsusc.2016.10.024
Tamulevičius, Sigitas ; Grigaliūnas, Viktoras ; Jucius, Dalius ; Lazauskas, Algirdas ; Andrulevičius, Mindaugas ; Sakaliūnienė, Jolita ; Abakevičienė, Brigita ; Kopustinskas, Vitoldas ; Smetona, Saulius. / Effects of 3D microlens transfer into fused silica substrate by CF4/O2 dry etching. In: Applied Surface Science. 2017 ; Vol. 393. pp. 287-293.
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abstract = "Nowadays, 3D microoptical elements find a variety of applications from light emitting diodes and household appliances to precise medical endoscopes. Such elements, fabricated in a fused silica substrate by combining 3D e-beam patterning and dry etching, can be used as a mold for the high throughput replication in polymeric materials by UV nanoimprint technique. Flexible and precise control of 3D shape in the resist layer can be achieved by e-beam patterning, but it is also very important to know peculiarities of 3D pattern transfer from resist layer into the fused silica substrate. This paper reports on the effects of PMMA 3D microlens pattern transfer into fused silica substrate by CF4/O2 dry etching. It is demonstrated that etching rate ratio between PMMA and fused silica changes during plasma treatment. Thus, the resulting shape of transferred 3D profile is different from the shape in PMMA and this variation must be assessed during the design phase.",
keywords = "Dry etching, e-Beam patterning, Fused silica, Microlens, PMMA",
author = "Sigitas Tamulevičius and Viktoras Grigaliūnas and Dalius Jucius and Algirdas Lazauskas and Mindaugas Andrulevičius and Jolita Sakaliūnienė and Brigita Abakevičienė and Vitoldas Kopustinskas and Saulius Smetona",
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Tamulevičius, S, Grigaliūnas, V, Jucius, D, Lazauskas, A, Andrulevičius, M, Sakaliūnienė, J, Abakevičienė, B, Kopustinskas, V & Smetona, S 2017, 'Effects of 3D microlens transfer into fused silica substrate by CF4/O2 dry etching', Applied Surface Science, vol. 393, pp. 287-293. https://doi.org/10.1016/j.apsusc.2016.10.024

Effects of 3D microlens transfer into fused silica substrate by CF4/O2 dry etching. / Tamulevičius, Sigitas; Grigaliūnas, Viktoras; Jucius, Dalius; Lazauskas, Algirdas; Andrulevičius, Mindaugas; Sakaliūnienė, Jolita; Abakevičienė, Brigita; Kopustinskas, Vitoldas; Smetona, Saulius.

In: Applied Surface Science, Vol. 393, 2017, p. 287-293.

Research output: Contribution to journalJournal articleResearchpeer-review

TY - JOUR

T1 - Effects of 3D microlens transfer into fused silica substrate by CF4/O2 dry etching

AU - Tamulevičius, Sigitas

AU - Grigaliūnas, Viktoras

AU - Jucius, Dalius

AU - Lazauskas, Algirdas

AU - Andrulevičius, Mindaugas

AU - Sakaliūnienė, Jolita

AU - Abakevičienė, Brigita

AU - Kopustinskas, Vitoldas

AU - Smetona, Saulius

PY - 2017

Y1 - 2017

N2 - Nowadays, 3D microoptical elements find a variety of applications from light emitting diodes and household appliances to precise medical endoscopes. Such elements, fabricated in a fused silica substrate by combining 3D e-beam patterning and dry etching, can be used as a mold for the high throughput replication in polymeric materials by UV nanoimprint technique. Flexible and precise control of 3D shape in the resist layer can be achieved by e-beam patterning, but it is also very important to know peculiarities of 3D pattern transfer from resist layer into the fused silica substrate. This paper reports on the effects of PMMA 3D microlens pattern transfer into fused silica substrate by CF4/O2 dry etching. It is demonstrated that etching rate ratio between PMMA and fused silica changes during plasma treatment. Thus, the resulting shape of transferred 3D profile is different from the shape in PMMA and this variation must be assessed during the design phase.

AB - Nowadays, 3D microoptical elements find a variety of applications from light emitting diodes and household appliances to precise medical endoscopes. Such elements, fabricated in a fused silica substrate by combining 3D e-beam patterning and dry etching, can be used as a mold for the high throughput replication in polymeric materials by UV nanoimprint technique. Flexible and precise control of 3D shape in the resist layer can be achieved by e-beam patterning, but it is also very important to know peculiarities of 3D pattern transfer from resist layer into the fused silica substrate. This paper reports on the effects of PMMA 3D microlens pattern transfer into fused silica substrate by CF4/O2 dry etching. It is demonstrated that etching rate ratio between PMMA and fused silica changes during plasma treatment. Thus, the resulting shape of transferred 3D profile is different from the shape in PMMA and this variation must be assessed during the design phase.

KW - Dry etching

KW - e-Beam patterning

KW - Fused silica

KW - Microlens

KW - PMMA

U2 - 10.1016/j.apsusc.2016.10.024

DO - 10.1016/j.apsusc.2016.10.024

M3 - Journal article

VL - 393

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EP - 293

JO - Applied Surface Science

JF - Applied Surface Science

SN - 0169-4332

ER -