Cooling trough, cooler and power module assembly

Toke Franke (Inventor), Ronald Eisele (Inventor), Reiner Hinken (Inventor), Frank Osterwald (Inventor), Klaus Olesen (Inventor), Lars Paulsen (Inventor)

Research output: Patent


The present invention discloses a cooling trough comprising an unflat surface, surrounding an opening of the cooling trough, configured with a height essentially decreasing inwardly. At least one supporting line, running around the opening of the cooling trough, is formed on the unflat surface. The at least one supporting line contacts a baseplate of a power module after the baseplate is attached to the unflat surface of the cooling trough. In addition, the present invention also discloses a cooler comprising the cooling trough and a power module assembly comprising the cooler.
Original languageEnglish
Patent numberUS 10306800 B2
Filing date19/11/2015
Publication statusPublished - 28. May 2019

Fingerprint Dive into the research topics of 'Cooling trough, cooler and power module assembly'. Together they form a unique fingerprint.

Cite this