Abstract
A physics-based analytical model for GaN high-electron-mobility transistors (HEMTs) with non-recessed- and recessed-gate structure is presented. Based on this model, the two-dimensional electron gas density (2DEG) and thereby the on-state resistance and breakdown voltage can be controlled by varying the barrier layer thickness and Al mole fraction in non-recessed depletion-mode GaN HEMTs. The analytical model indicates that the 2DEG charge density in the channel increases from 2.4 × 1012 cm−2 to 1.8 × 1013 cm−2 when increasing the Al mole fraction from x = 0.1 to 0.4 for an experimental non-recessed-gate GaN HEMT. In the recessed-gate GaN HEMT, in addition to these parameters, the recess height can also control the 2DEG to achieve high-performance power electronic devices. The model also calculates the critical recess height for which a normally-ON GaN switch becomes normally-OFF. This model shows good agreement with reported experimental results and promises to become a useful tool for advanced design of GaN HEMTS.
Original language | English |
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Journal | Journal of Electronic Materials |
Volume | 50 |
Issue number | 7 |
Pages (from-to) | 3923-3929 |
ISSN | 0361-5235 |
DOIs | |
Publication status | Published - Jul 2021 |
Keywords
- GaN high-electron-mobility transistor (HEMT)
- recess height
- recessed gate
- two-dimensional electron gas (2DEG)