Project Details
Description
Polypropylene capacitors are the most widely used dielectric capacitors in power electronics for their reliability and self-healing capabilities. However, as
manufacturers build more compact and energy efficient devices, capacitors with operating temperatures up to 200°C are needed, while polypropylene capacitors cannot function beyond 105°C. The aim of this project is therefore to invent a self-healing polymer capacitor that operates reliably at high voltages (E ≥ 300 MV/m) at 200°C and can be fabricated at scale. To achieve this, we will fabricate devices using hybrid networks with a liquid element embedded into the network structure that will be processed through a novel bottom-up layer-by-layer printing technique that can be adapted to industrial production. This fabrication technique will be combined with dielectric and thermal simulations to guide the design of the dielectric structure for optimal temperature performance.
manufacturers build more compact and energy efficient devices, capacitors with operating temperatures up to 200°C are needed, while polypropylene capacitors cannot function beyond 105°C. The aim of this project is therefore to invent a self-healing polymer capacitor that operates reliably at high voltages (E ≥ 300 MV/m) at 200°C and can be fabricated at scale. To achieve this, we will fabricate devices using hybrid networks with a liquid element embedded into the network structure that will be processed through a novel bottom-up layer-by-layer printing technique that can be adapted to industrial production. This fabrication technique will be combined with dielectric and thermal simulations to guide the design of the dielectric structure for optimal temperature performance.
Acronym | XlinkCap |
---|---|
Status | Active |
Effective start/end date | 09/10/2023 → 08/10/2025 |
Collaborative partners
- Technical University of Denmark (lead)
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