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  • 2017

    Design of microchannel heat sink using topology optimization for high power modules cooling

    Xu, L., Li, H., Ding, X. & Liu, S., 19. Sept 2017, 18th International Conference on Electronic Packaging Technology, ICEPT 2017. Wang, C., Tian, Y. & Ye, T. (eds.). IEEE, p. 1092-1097 8046632

    Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review