Revisiting the optimal thickness profile of cooling fins: optimality conditions and branching

Activity: Talks and presentationsConference presentations

Description

Conference presentation at ITherm 2021.
Period1. Jun 20214. Jun 2021
Event title20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2021)
Event typeConference
Conference number20
LocationSan Diego, United States
Degree of RecognitionInternational

Keywords

  • cooling fin
  • optimality conditions
  • branching
  • topology optimisation