Weaving electronic circuit into two-layer fabric

Jussi Mikkonen, Emmi Pouta

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Abstrakt

This paper describes the creation of a woven two-layer fabric, created using two-warp system. The fabric is designed to contain components inside the two layers, with the power supply signals on top- and bottomlayers. The surface mounted components are prepared for weaving by adding long insulated threads, to be partially removed accordingly just before integrating to the fabric. The final fabric contains a working circuit for detecting magnetic fields as an example implementation.

OriginalsprogEngelsk
TitelUbiComp and ISWC 2015 - Proceedings of the 2015 ACM International Joint Conference on Pervasive and Ubiquitous Computing and the Proceedings of the 2015 ACM International Symposium on Wearable Computers
ForlagAssociation for Computing Machinery
Publikationsdato2015
Sider245-248
ISBN (Elektronisk)9781450335751
DOI
StatusUdgivet - 2015
Udgivet eksterntJa
BegivenhedACM International Joint Conference on Pervasive and Ubiquitous Computing and the 2015 ACM International Symposium on Wearable Computers, UbiComp and ISWC 2015 - Osaka, Japan
Varighed: 7. sep. 201511. sep. 2015

Konference

KonferenceACM International Joint Conference on Pervasive and Ubiquitous Computing and the 2015 ACM International Symposium on Wearable Computers, UbiComp and ISWC 2015
LandJapan
ByOsaka
Periode07/09/201511/09/2015
SponsorACM SIGCHI, Bell Labs, Microsoft, Panasonic, SIGMOBILE

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Citationsformater

Mikkonen, J., & Pouta, E. (2015). Weaving electronic circuit into two-layer fabric. I UbiComp and ISWC 2015 - Proceedings of the 2015 ACM International Joint Conference on Pervasive and Ubiquitous Computing and the Proceedings of the 2015 ACM International Symposium on Wearable Computers (s. 245-248). Association for Computing Machinery. https://doi.org/10.1145/2800835.2800936