Topology optimization of heat sinks for instantaneous chip cooling using a transient pseudo-3D thermofluid model

Tao Zeng, Hu Wang^*, Mengzhu Yang, Joe Alexandersen

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Hunan University

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Topology optimization of heat sinks for instantaneous chip cooling using a transient pseudo-3D thermofluid model
Alexandersen, J. (Underviser)
27. aug. 2020
Aktivitet: Foredrag og mundtlige bidrag › Konferenceoplæg