TY - GEN
T1 - OPTIMIZATION OF FILM CAPACITORS
T2 - A NEW COSMOS OR JUST A CHAOS
AU - Gkionis-Konstantatos, Odysseas
PY - 2025/10/2
Y1 - 2025/10/2
N2 - In the realm of green energy technologies, the demand for capacitors capable of
operating under elevated electric fields and high temperatures has become
increasingly urgent. Literature analyses highlight the industrial preference for
polymer film capacitors, with biaxially oriented polypropylene (BOPP) remaining the
state-of-the-art dielectric due to its efficient self-clearing capability and
cost-effectiveness. However, its inherently low energy density and limited operating
temperature range necessitate optimization to meet the ongoing pursuit of a universal
capacitor technology.
Despite over 70 years of industrial maturity, metallized polypropylene film capacitors
(MPPFCs) continue to reveal new insights. Their partially understood potential arises
from the semicrystalline nature of BOPP, which can be readily altered to yield
different dielectric behaviors. This thesis investigates the performance of ultrathin 1.9
µm BOPP films when employed in capacitor systems.
The first study examined the effect of reduced dielectric thickness using single- and
double-layer capacitor samples. Thinner films were found to lower breakdown
strength, enlarge clearing sites, and increase variability in post-breakdown
capacitance, underscoring the need for alternative optimization approaches. To
address this, a multilayer design integrating tungsten oxide (WO3
) and aluminum
nitride (AlN) was implemented, which improved heat dissipation, enhanced
breakdown strength at the 63.2% unreliability level, and reduced clearing site
variability, as confirmed by thermal imaging and simulations.
In parallel, thermal annealing of BOPP films prior to capacitor assembly was shown
to promote molecular chain alignment, increase crystallinity, improve surface
morphology, and strengthen metallization adhesion. These modifications resulted in
higher melting points, improved thermal stability, and a ductility–strength trade-off
with reduced mechanical variability. Electrically, annealed films demonstrated higher
breakdown strength across all unreliability levels, smaller and more uniform
breakdown sites, and stable capacitance retention, verified also in double-layer
capcitor stack configurations.
Collectively, these findings demonstrate that multilayer integration and heat
treatment provide effective pathways to mitigate the reliability challenges of ultrathin
BOPP, offering a framework for advancing next-generation MPPFCs. The outcomes
further reflect on both industrial and laboratory practices, providing new insights for
future capacitor optimization.
AB - In the realm of green energy technologies, the demand for capacitors capable of
operating under elevated electric fields and high temperatures has become
increasingly urgent. Literature analyses highlight the industrial preference for
polymer film capacitors, with biaxially oriented polypropylene (BOPP) remaining the
state-of-the-art dielectric due to its efficient self-clearing capability and
cost-effectiveness. However, its inherently low energy density and limited operating
temperature range necessitate optimization to meet the ongoing pursuit of a universal
capacitor technology.
Despite over 70 years of industrial maturity, metallized polypropylene film capacitors
(MPPFCs) continue to reveal new insights. Their partially understood potential arises
from the semicrystalline nature of BOPP, which can be readily altered to yield
different dielectric behaviors. This thesis investigates the performance of ultrathin 1.9
µm BOPP films when employed in capacitor systems.
The first study examined the effect of reduced dielectric thickness using single- and
double-layer capacitor samples. Thinner films were found to lower breakdown
strength, enlarge clearing sites, and increase variability in post-breakdown
capacitance, underscoring the need for alternative optimization approaches. To
address this, a multilayer design integrating tungsten oxide (WO3
) and aluminum
nitride (AlN) was implemented, which improved heat dissipation, enhanced
breakdown strength at the 63.2% unreliability level, and reduced clearing site
variability, as confirmed by thermal imaging and simulations.
In parallel, thermal annealing of BOPP films prior to capacitor assembly was shown
to promote molecular chain alignment, increase crystallinity, improve surface
morphology, and strengthen metallization adhesion. These modifications resulted in
higher melting points, improved thermal stability, and a ductility–strength trade-off
with reduced mechanical variability. Electrically, annealed films demonstrated higher
breakdown strength across all unreliability levels, smaller and more uniform
breakdown sites, and stable capacitance retention, verified also in double-layer
capcitor stack configurations.
Collectively, these findings demonstrate that multilayer integration and heat
treatment provide effective pathways to mitigate the reliability challenges of ultrathin
BOPP, offering a framework for advancing next-generation MPPFCs. The outcomes
further reflect on both industrial and laboratory practices, providing new insights for
future capacitor optimization.
U2 - 10.21996/3658bd87-214b-46c0-9469-df797ede7772
DO - 10.21996/3658bd87-214b-46c0-9469-df797ede7772
M3 - Ph.D. thesis
PB - Syddansk Universitet. Det Tekniske Fakultet
ER -