Design of TEM Transmission Line for Probe Calibration up to 40 GHz

Morten Sorensen, Shubhankar Marathe, David Pommerenke, Hamed Kajbaf, Jin Mint

Publikation: Bidrag til bog/antologi/rapport/konference-proceedingKonferencebidrag i proceedingsForskningpeer review

Resumé

With the ongoing development of 5G wireless communication, frequencies as high as 40 GHz have become relevant for EMI near-field scanning. This paper describes the development process of two transmission lines with air dielectrics for probe calibration, namely a rod over ground plane and an air trace. Because of homogeneous dielectrics the transmission lines become almost pure TEM, which is preferable regarding probe calibration to a coplanar waveguide (quasi- Tem). The design process shows that at very high frequencies, transitions in the transmission line are critical and all small physical details must be included in the simulation model in order for it to be reliable.

OriginalsprogEngelsk
Titel2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018
ForlagIEEE
Publikationsdato17. okt. 2018
Artikelnummer8495329
ISBN (Elektronisk)9781538666210
DOI
StatusUdgivet - 17. okt. 2018
Udgivet eksterntJa
Begivenhed2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018 - Long Beach, USA
Varighed: 30. jul. 20183. aug. 2018

Konference

Konference2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018
LandUSA
ByLong Beach
Periode30/07/201803/08/2018

Fingeraftryk

Electric lines
Calibration
Transmission electron microscopy
Coplanar waveguides
Air
Scanning
Communication

Citer dette

Sorensen, M., Marathe, S., Pommerenke, D., Kajbaf, H., & Mint, J. (2018). Design of TEM Transmission Line for Probe Calibration up to 40 GHz. I 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018 [8495329] IEEE. https://doi.org/10.1109/EMCSI.2018.8495329
Sorensen, Morten ; Marathe, Shubhankar ; Pommerenke, David ; Kajbaf, Hamed ; Mint, Jin. / Design of TEM Transmission Line for Probe Calibration up to 40 GHz. 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018. IEEE, 2018.
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abstract = "With the ongoing development of 5G wireless communication, frequencies as high as 40 GHz have become relevant for EMI near-field scanning. This paper describes the development process of two transmission lines with air dielectrics for probe calibration, namely a rod over ground plane and an air trace. Because of homogeneous dielectrics the transmission lines become almost pure TEM, which is preferable regarding probe calibration to a coplanar waveguide (quasi- Tem). The design process shows that at very high frequencies, transitions in the transmission line are critical and all small physical details must be included in the simulation model in order for it to be reliable.",
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Sorensen, M, Marathe, S, Pommerenke, D, Kajbaf, H & Mint, J 2018, Design of TEM Transmission Line for Probe Calibration up to 40 GHz. i 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018., 8495329, IEEE, 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018, Long Beach, USA, 30/07/2018. https://doi.org/10.1109/EMCSI.2018.8495329

Design of TEM Transmission Line for Probe Calibration up to 40 GHz. / Sorensen, Morten; Marathe, Shubhankar; Pommerenke, David; Kajbaf, Hamed; Mint, Jin.

2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018. IEEE, 2018. 8495329.

Publikation: Bidrag til bog/antologi/rapport/konference-proceedingKonferencebidrag i proceedingsForskningpeer review

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Sorensen M, Marathe S, Pommerenke D, Kajbaf H, Mint J. Design of TEM Transmission Line for Probe Calibration up to 40 GHz. I 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018. IEEE. 2018. 8495329 https://doi.org/10.1109/EMCSI.2018.8495329