Challenges of fabricating plasmonic and photonic structures with Neon ion beam milling

Publikation: Konferencebidrag uden forlag/tidsskriftPosterForskning

Resumé

The unique properties of surface plasmons permitting subwavelength confinement of light, ultrafast propagation, and highly localized sensing are the key features for combining broadband optics and nanoscale electronics. Potential applications of plasmon-based devices span both nanoscale structures in future on-chip communication, processing and sensing, and macroscopic optical devices, such as polarizers and filters.
For all these kind of devices a reliable technique to produce plasmonic structures with nanometer precision is required. So far fabrication has been mainly conducted with well-established electron beam lithography and focussed ion beam milling (FIB) using Gallium ions. These techniques, however, are to some extend limited in their resolution, and in addition Gallium and Carbon are implanted and deposited into the plasmonic structures during FIB process, potentially changing plasmonic properties.
We are currently studying the capabilities of focussed Helium and Neon ion beam milling for the fabricating of plasmonic and photonic devices. We found that Neon ion beam milling enables us to prepare plasmonic structures, such as trenches (see Fig. 1) and V-grooves without doping and alloying effects specific to Galium FIB. Neon FIB milling is superior to Helium FIB milling in terms of the processing speed and smaller levels of implanted ions. From our perspective it is the most promising technique for the fabrication of individual plasmonic devices with a few nanometers precision.
The main challenges of utilization of Ne FIB include: 1) Fabrication of metallic trenches with high depth/width aspect ratios. (such structures are predicted theoretically to have exceptional optical properties); 2) Low writing-speed in comparison to conventional electron beam lithography and Ga FIB milling.
In our presentation we show the current progress in Neon FIB milling of plasmonic structures. We compare different materials, in particular poly- and mono-crystalline gold as well as thin films of Titanium Nitride, which are commonly used for plasmonic applications.
OriginalsprogEngelsk
Publikationsdato8. jun. 2016
Antal sider1
StatusUdgivet - 8. jun. 2016
Begivenhed1st International Conference on Helium Ion Microscopy and Emerging Focused Ion Beam Technologies - Neumünster Abbey, Luxembourg City, Luxemborg
Varighed: 8. jun. 201610. jun. 2016
Konferencens nummer: 1
http://hefib2016.list.lu/

Konference

Konference1st International Conference on Helium Ion Microscopy and Emerging Focused Ion Beam Technologies
Nummer1
LokationNeumünster Abbey
LandLuxemborg
ByLuxembourg City
Periode08/06/201610/06/2016
Internetadresse

Fingeraftryk

neon
ion beams
photonics
helium ions
fabrication
gallium
lithography
electron beams
V grooves
titanium nitrides
polarizers
plasmons
alloying
aspect ratio
ions
communication
chips
optics
gold
broadband

Citer dette

Leißner, T., Fiutowski, J., Bozhevolnyi, S. I., Rubahn, H-G., & Chiriaev, S. (2016). Challenges of fabricating plasmonic and photonic structures with Neon ion beam milling. Poster session præsenteret på 1st International Conference on Helium Ion Microscopy and Emerging Focused Ion Beam Technologies , Luxembourg City, Luxemborg.
Leißner, Till ; Fiutowski, Jacek ; Bozhevolnyi, Sergey I. ; Rubahn, Horst-Günter ; Chiriaev, Serguei . / Challenges of fabricating plasmonic and photonic structures with Neon ion beam milling. Poster session præsenteret på 1st International Conference on Helium Ion Microscopy and Emerging Focused Ion Beam Technologies , Luxembourg City, Luxemborg.1 s.
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abstract = "The unique properties of surface plasmons permitting subwavelength confinement of light, ultrafast propagation, and highly localized sensing are the key features for combining broadband optics and nanoscale electronics. Potential applications of plasmon-based devices span both nanoscale structures in future on-chip communication, processing and sensing, and macroscopic optical devices, such as polarizers and filters. For all these kind of devices a reliable technique to produce plasmonic structures with nanometer precision is required. So far fabrication has been mainly conducted with well-established electron beam lithography and focussed ion beam milling (FIB) using Gallium ions. These techniques, however, are to some extend limited in their resolution, and in addition Gallium and Carbon are implanted and deposited into the plasmonic structures during FIB process, potentially changing plasmonic properties.We are currently studying the capabilities of focussed Helium and Neon ion beam milling for the fabricating of plasmonic and photonic devices. We found that Neon ion beam milling enables us to prepare plasmonic structures, such as trenches (see Fig. 1) and V-grooves without doping and alloying effects specific to Galium FIB. Neon FIB milling is superior to Helium FIB milling in terms of the processing speed and smaller levels of implanted ions. From our perspective it is the most promising technique for the fabrication of individual plasmonic devices with a few nanometers precision. The main challenges of utilization of Ne FIB include: 1) Fabrication of metallic trenches with high depth/width aspect ratios. (such structures are predicted theoretically to have exceptional optical properties); 2) Low writing-speed in comparison to conventional electron beam lithography and Ga FIB milling.In our presentation we show the current progress in Neon FIB milling of plasmonic structures. We compare different materials, in particular poly- and mono-crystalline gold as well as thin films of Titanium Nitride, which are commonly used for plasmonic applications.",
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Leißner, T, Fiutowski, J, Bozhevolnyi, SI, Rubahn, H-G & Chiriaev, S 2016, 'Challenges of fabricating plasmonic and photonic structures with Neon ion beam milling' 1st International Conference on Helium Ion Microscopy and Emerging Focused Ion Beam Technologies , Luxembourg City, Luxemborg, 08/06/2016 - 10/06/2016, .

Challenges of fabricating plasmonic and photonic structures with Neon ion beam milling. / Leißner, Till; Fiutowski, Jacek; Bozhevolnyi, Sergey I.; Rubahn, Horst-Günter; Chiriaev, Serguei .

2016. Poster session præsenteret på 1st International Conference on Helium Ion Microscopy and Emerging Focused Ion Beam Technologies , Luxembourg City, Luxemborg.

Publikation: Konferencebidrag uden forlag/tidsskriftPosterForskning

TY - CONF

T1 - Challenges of fabricating plasmonic and photonic structures with Neon ion beam milling

AU - Leißner, Till

AU - Fiutowski, Jacek

AU - Bozhevolnyi, Sergey I.

AU - Rubahn, Horst-Günter

AU - Chiriaev, Serguei

PY - 2016/6/8

Y1 - 2016/6/8

N2 - The unique properties of surface plasmons permitting subwavelength confinement of light, ultrafast propagation, and highly localized sensing are the key features for combining broadband optics and nanoscale electronics. Potential applications of plasmon-based devices span both nanoscale structures in future on-chip communication, processing and sensing, and macroscopic optical devices, such as polarizers and filters. For all these kind of devices a reliable technique to produce plasmonic structures with nanometer precision is required. So far fabrication has been mainly conducted with well-established electron beam lithography and focussed ion beam milling (FIB) using Gallium ions. These techniques, however, are to some extend limited in their resolution, and in addition Gallium and Carbon are implanted and deposited into the plasmonic structures during FIB process, potentially changing plasmonic properties.We are currently studying the capabilities of focussed Helium and Neon ion beam milling for the fabricating of plasmonic and photonic devices. We found that Neon ion beam milling enables us to prepare plasmonic structures, such as trenches (see Fig. 1) and V-grooves without doping and alloying effects specific to Galium FIB. Neon FIB milling is superior to Helium FIB milling in terms of the processing speed and smaller levels of implanted ions. From our perspective it is the most promising technique for the fabrication of individual plasmonic devices with a few nanometers precision. The main challenges of utilization of Ne FIB include: 1) Fabrication of metallic trenches with high depth/width aspect ratios. (such structures are predicted theoretically to have exceptional optical properties); 2) Low writing-speed in comparison to conventional electron beam lithography and Ga FIB milling.In our presentation we show the current progress in Neon FIB milling of plasmonic structures. We compare different materials, in particular poly- and mono-crystalline gold as well as thin films of Titanium Nitride, which are commonly used for plasmonic applications.

AB - The unique properties of surface plasmons permitting subwavelength confinement of light, ultrafast propagation, and highly localized sensing are the key features for combining broadband optics and nanoscale electronics. Potential applications of plasmon-based devices span both nanoscale structures in future on-chip communication, processing and sensing, and macroscopic optical devices, such as polarizers and filters. For all these kind of devices a reliable technique to produce plasmonic structures with nanometer precision is required. So far fabrication has been mainly conducted with well-established electron beam lithography and focussed ion beam milling (FIB) using Gallium ions. These techniques, however, are to some extend limited in their resolution, and in addition Gallium and Carbon are implanted and deposited into the plasmonic structures during FIB process, potentially changing plasmonic properties.We are currently studying the capabilities of focussed Helium and Neon ion beam milling for the fabricating of plasmonic and photonic devices. We found that Neon ion beam milling enables us to prepare plasmonic structures, such as trenches (see Fig. 1) and V-grooves without doping and alloying effects specific to Galium FIB. Neon FIB milling is superior to Helium FIB milling in terms of the processing speed and smaller levels of implanted ions. From our perspective it is the most promising technique for the fabrication of individual plasmonic devices with a few nanometers precision. The main challenges of utilization of Ne FIB include: 1) Fabrication of metallic trenches with high depth/width aspect ratios. (such structures are predicted theoretically to have exceptional optical properties); 2) Low writing-speed in comparison to conventional electron beam lithography and Ga FIB milling.In our presentation we show the current progress in Neon FIB milling of plasmonic structures. We compare different materials, in particular poly- and mono-crystalline gold as well as thin films of Titanium Nitride, which are commonly used for plasmonic applications.

M3 - Poster

ER -

Leißner T, Fiutowski J, Bozhevolnyi SI, Rubahn H-G, Chiriaev S. Challenges of fabricating plasmonic and photonic structures with Neon ion beam milling. 2016. Poster session præsenteret på 1st International Conference on Helium Ion Microscopy and Emerging Focused Ion Beam Technologies , Luxembourg City, Luxemborg.