Wang, Y., Sobolewska, E., Fiutowski, J., Albers, J., Nebling, E., Wagner, B., Benecke, W., Rubahn, H-G. & Oliveira Hansen, R. M. D., 2016, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016.IEEE, s. 151-154 7514858
Publikation: Kapitel i bog/rapport/konference-proceeding › Konferencebidrag i proceedings › Forskning › peer review